1.High Heat performance : Achieving high heat efficiency by professional thermal knowledge and simulation of the matching between heat consumption and capacity, the heating zone is shortened and optimized the output.
2. Low power consumption : Verified by theory and practice, our products are able to minimize the temperature consumption between different size of components in order to achieve the best heat evenness.
3.Large size: Can handle larger size PCB board in the same shape and size of the body.
